Telit reduces form factor for IoT modules
October 18, 2018
Telit announced the xE310 family of miniature IoT modules at this week’s IoT Solutions World Congress in Barcelona.
With initial models planned in LTE-M, NB-IoT and European 2G, the new form factor should let the Italian company meet growing demand for ultra-small, high-performance modules for wearable medical devices, fitness trackers, industrial sensors, smart metering and other mass-production, massive deployment applications.
Shipments of the modules are due to start before the end of this year.
The xE310 family is one of the smallest LGA form factors available in the market with a flexible perimeter footprint supporting various sizes from compact to smaller than 200mm2. Its 94 pads include spares to provide the flexibility to deliver support for additional features as technologies, applications and markets evolve.
Spares can be used for modules supporting Bluetooth, wifi or enhanced location technologies in addition to cellular while maintaining compatibility with cellular only models. They can also be used for extra connections that may be required for new 5G-enabled features.
The form factor also gives OEMs more flexibility, efficiency and yield during design and manufacturing. The family is said to provide easy PCB routing while reducing manufacturing process issues such as planarity and bending. The circular pad facilitates correct package orientation for automated assembly.
"The new xE310 is among the smallest form factors available today despite being packed with technologies and capabilities that developers and designers say they need to enable tomorrow's IoT applications," said Yossi Moscovitz, Telit president of products. "With this new form factor, xE310 modules can comfortably take IoT integration across all industries seamlessly from current standards, way into 5G many years from now; much the same way the standard setting xE910 has done over the past ten years."