TDK unveils DC-DC converters for IoT at Apec
March 21, 2019
At this week’s Apec show in Anaheim, California, Japanese electronics manufacturer TDK unveiled µPol DC-DC converters for applications such as big data, machine learning, artificial intelligence, 5G cells, IoT and computing enterprise.
Rather than using side-by-side a discrete integrated circuit and discrete inductor, the FS series integrates the IC and inductor in a compact configuration that provides high density for space-constrained applications requiring a low-profile power source.
At 3.3 by 3.3 by 1.5mm, they can reduce the required external components, retaining performance while offering a simplified design for ease of integration. This family can deliver a density of 1W/mm3 at a claimed half the size of other products available in its class. As a result, this lowers system cost, reduces board size and assembly costs, as well as BoM and PCB costs.
It operates at a junction temperature from -40 to +125˚C. Mass production of the FS1406 is expected to begin in the third quarter of this year.
TDK has been developing patents related to these innovations (US 9,729,059 and US 10,193,442) over several years. The µPol devices were developed by TDK’s group company Faraday Semi. These products incorporate semiconductors in packaging technologies such as semiconductor embedded in substrate and electronic components to achieve a smaller size and lower profile by 3D integration. TDK says this integration allows it to deliver higher efficiency and ease of use at a lower total system cost.
The µPol technology includes a DC-DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs and others. By reducing the distance between the converter and the chipset, the resistance and the inductance components are also reduced, allowing fast response and accurate regulation with dynamic load currents.
The product family is rated for industrial application, is lead free and has RoHS compliance.