Infineon ships industrial grade eSIM in small package
December 12, 2018
To help M2M communications achieve reliable data collection and uninterrupted data transmission, taking advantage of ubiquitous mobile networks, Infineon Technologies has introduced an industrial-grade embedded SIM (eSIM) in a miniature wafer-level chip-scale package.
Manufacturers of industrial machines and equipment ranging from vending machines to remote sensors to asset trackers can use the German electronic company’s device to optimise the design of their IoT devices without compromising on security and quality.
Deploying eSIM brings a number of advantages for a smooth adoption of cellular connectivity in industrial environments. Device manufacturers can increase their design flexibility due to the eSIM’s small footprint, and simplify manufacturing processes as well as global distribution thanks to a single stock-keeping unit. Users also have the possibility to change their mobile service provider at any time, for example, if the quality of the network deteriorates or in the event of a better contract from a mobile operator.
However, providing robust quality on a miniature footprint that works even under harshest conditions remains a challenge for silicon providers. Infineon believes it is addressing this challenge with its SLM 97 security controller in a wafer level chip scale package. This measures 2.5 by 2.7mm and supports a temperature range of -40 to +105˚C.
It provides a feature set compliant with the latest GSMA specifications for eSIM. Robust quality and endurance for industrial eSIM applications are said to reflect Infineon’s focus on quality and the mindset working towards zero defects.
The SLM 97 security chip is manufactured at Infineon’s production sites in Dresden and Regensburg and is available in volume quantities.