Proving the Business Case for the Internet of Things

IDT module provides 6LoWPan connectivity

Steve Rogerson
November 20, 2018
California-based Integrated Device Technology (IDT) has introduced an FCC certified module that provides critical and secure 6LoWPan wireless connectivity to link devices to the IoT.
The ZWIR4532 connectivity module also provides the optional IDT SensorShare firmware, a 6LoWPan open standard stack that communicates natively with IPv6 over IEEE 802.15.4 radio links; it has no associated licence fees or royalties. This lets enable users focus on their applications without the burden of building IoT products and services from the ground up.
The low power consumption and small form factor – approximately half that of other ZWIR45xx modules – makes it suitable for embedding into various IoT-connected consumer, industrial and medical devices with space constraints, including home automation devices, factory automation monitors, environmental sensors and LED lamps for smart city applications. 
"Product designers can create a wide range of securely connected IoT devices thanks to our new ZWIR4532 module, which combines our proven 6LoWPan wireless connectivity and SensorShare firmware that give it many advantages over competitors' modules," said Sailesh Chittipeddi, IDT's chief technology officer. "The ZWIR4532 is an example of our commitment to providing complete solutions that address the need for secure IoT connectivity, and expand on our popular ZWIR45xx family of modules."
The module incorporates an Arm microcontroller, a sub-gigahertz radio transceiver and optional licence-free IDT firmware download. It supports native communications with computers and mobile devices through IPv6 and has the ability to create self-healing ad-hoc mesh networks for covering large areas and long ranges. Secure connectivity is based on open standard security protocols.
The module is also suitable for battery-powered devices as its low power requirements increase battery life.
IDT makes RF, timing, memory interface, real-time interconnect, optical interconnect, wireless power and smart sensor products among its array of mixed-signal devices for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, it has design, manufacturing, sales facilities and distribution partners throughout the world.